公开(公告)号：US20240304423A1

公开(公告)日：2024-09-12

申请号：US18181077

申请日：2023-03-09

Applicant: Applied Materials, Inc.

Inventor： Laksheswar Kalita ,  Joseph Behnke ,  Ryan Pakulski ,  Christopher L. Beaudry ,  Jonathan Strahle

IPC: H01J37/32 ,  C23C16/40 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/50 ,  C23C16/56

CPC classification number: H01J37/32495 ,  C23C16/405 ,  C23C16/4404 ,  C23C16/45565 ,  C23C16/4583 ,  C23C16/50 ,  C23C16/56 ,  H01J37/32816 ,  H01J2237/0453

Abstract: The present technology is generally directed to semiconductor processing systems and methods. Systems and methods include a chamber having a plurality of chamber components, such as a pedestal, a lid stack, a faceplate, electrode, and a showerhead. The faceplate is supported with the lid stack and defines a plurality of first apertures and the showerhead is positioned between the faceplate and the pedestal and defines a plurality of second apertures. In systems and methods, the faceplate, the showerhead, the lid stack, the pedestal, or a combination thereof include an yttrium fluoride, yttrium oxyfluoride, or both yttrium fluoroide and yttrium oxyfluoride coating having a thickness of greater than 10 μm on at least a portion of the respective chamber component or combination thereof.