公开(公告)号：US20210404059A1

公开(公告)日：2021-12-30

申请号：US17003622

申请日：2020-08-26

Applicant: Applied Materials, Inc.

Inventor： Muhammad M. RASHEED ,  Anqing CUI

IPC: C23C16/455 ,  C23C16/52

Abstract: Embodiments provided herein generally relate to a processing system and a method of controlling conductance in a processing system. The processing system and method disclosed herein allow for control of gas ratios within the processing system, while still maintaining a high level of conductance. The processing system includes a purge gas valve configured to pulse a flow of foreline purge gas. The method includes pulsing the foreline purge gas. The method is contained in a computer readable medium. The pulsed foreline purge gas can maintain a ratio of process purge gas and the process gas in the processing region.