-
公开(公告)号:US20250071888A1
公开(公告)日:2025-02-27
申请号:US18781453
申请日:2024-07-23
Applicant: Apple Inc.
Inventor: Shawn X. ARNOLD , Zhongqing GONG , Anping GUO
Abstract: The present disclosure describes a structure with a substrate, a damping structure, and a capacitor structure. The damping structure is disposed over the substrate and includes a rigid material layer and a damping material layer disposed on the rigid material layer. The damping material layer includes a damping material with a tensile strength of about 20 MPa, a Young's modulus of about 0.5 GPa, and an elongation of about 10%. The capacitor structure is disposed over the damping structure, in which the damping structure mitigates (or eliminates) a transfer of piezoelectric and electrostrictive vibrations generated by the capacitor structure to the substrate.