公开(公告)号：US10424438B2

公开(公告)日：2019-09-24

申请号：US15275369

申请日：2016-09-24

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Curtis C. Mead ,  Scott D. Morrison ,  Giancarlo F. De La Cruz ,  Lin Chen ,  Albert Wang ,  Brad W Simeral ,  Vu Vo ,  Wyeman Chen

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30 ,  H01G2/06 ,  H05K3/34

Abstract: Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.

公开(公告)号：US20170208690A1

公开(公告)日：2017-07-20

申请号：US15275369

申请日：2016-09-24

Applicant: Apple Inc.

Inventor： Paul A. Martinez ,  Curtis C. Mead ,  Scott D. Morrison ,  Giancarlo F. De La Cruz ,  Lin Chen ,  Albert Wang ,  Brad W. Simeral ,  Vu Vo ,  Wyeman Chen

IPC: H05K1/18 ,  H05K1/11 ,  H01G4/30 ,  H01G4/228 ,  H01G4/38 ,  H01G4/005 ,  H01G2/06 ,  H05K3/30 ,  H01G4/40

Abstract: Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.