公开(公告)号：US20240192506A1

公开(公告)日：2024-06-13

申请号：US18444114

申请日：2024-02-16

Applicant: Apple Inc.

Inventor： Christopher Patton ,  Michael J. Oudenhoven ,  Suresh C. Gopalan

IPC: G02B27/01

CPC classification number: G02B27/0176 ,  G02B2027/0178

Abstract: A head-mounted device may have a head-mounted frame with lens openings. The head-mounted device may have left and right lenses mounted in the lens openings. The lenses may include waveguides that help guide images from projectors to eye boxes for viewing by a user. The frame may include a metal frame member that supplies the frame with structural support. Circuitry such as strain gauge circuitry and cabling may be coupled to the metal frame member. A protective polymer such as thermoset epoxy may be used to encapsulate and protect the circuitry. The protective polymer may encapsulate the strain gauge, the cabling, and/or other circuitry so that this circuitry need not be exposed to elevated temperatures during subsequent injection molding operations. Injection molding may be used to apply one or more shots of thermoplastic polymer to the metal frame member to form the head-mounted frame.