公开(公告)号：US20230336708A1

公开(公告)日：2023-10-19

申请号：US18213780

申请日：2023-06-23

Applicant: Apple Inc.

Inventor： Ritu SHAH ,  Forrest C. WANG

IPC: H04N17/00 ,  H04N5/38 ,  H04N23/80 ,  H04N23/695 ,  H04R1/02

CPC classification number: H04N17/004 ,  H04N5/38 ,  H04N23/80 ,  H04N23/695 ,  H04R1/028 ,  H04R2499/15 ,  H02J7/0042

Abstract: A head-mountable device can include display elements and/or cameras that can be calibrated for accurate recording and visual output. Whereas some aspects of a head-mountable device can be calibrated at the time of production, usage and wear of the head-mountable device can result in certain components becoming misaligned. A case or other reference can be used to calibrate the cameras of the head-mountable device to ensure that the captured images are recorded in a target alignment. The case can be operated with the head-mountable device to calibrate the display elements of the head-mountable device to ensure that the images are output in a target alignment. Such calibration can include consideration of any lenses installed in front of the display elements.

公开(公告)号：US20250004501A1

公开(公告)日：2025-01-02

申请号：US18693140

申请日：2022-09-16

Applicant: Apple Inc.

Inventor： Ritu SHAH ,  Edward S. HUO ,  Anthony S. MONTEVIRGEN

IPC: G06F1/16 ,  H05K7/20

Abstract: A head-mountable device (100) can include electronic circuits, such as cameras (150, 350, 450), sensors (170), and input/output devices. The head-mountable device can secure such electronic circuits with an assembly that also provides thermal dissipation, electrical grounding, and a sealed chamber (312, 412) to isolate the electronic circuit from ingress of debris. The assembly can provide a degree of mobility, where desired. Accordingly, the electronic circuit can operate more optimally and with lower risk of degradation and interference with other components of the head-mountable device.

公开(公告)号：US20230229007A1

公开(公告)日：2023-07-20

申请号：US18122056

申请日：2023-03-15

Applicant: Apple Inc.

Inventor： Ritu SHAH ,  Yoonhoo Jo ,  Forrest C. Wang ,  Scott M. Leinweber ,  Adam Y. Kollgaard

IPC: G02B27/01 ,  G02B27/00

CPC classification number: G02B27/0176 ,  G02B27/0093 ,  G02B27/0172 ,  G02B2027/0138 ,  G02B2027/014

Abstract: A head-mountable device can include modules that provide fit adjustment capabilities when assembled together. By providing a head-mountable device with modular features, certain modules can provide fit adjustment capabilities without requiring other modules to be custom designed or available in a wide variety of sizes and/or shapes. The head-mountable device and/or other electronic devices can be operated to guide a user to select the optimal light seal module for use with an HMD module. For example, the head-mountable device or another device can include sensors for detecting features of the user's face, forces distributed on the face when worn, and/or entry of light from an external environment.