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公开(公告)号:US20220271419A1
公开(公告)日:2022-08-25
申请号:US17447555
申请日:2021-09-13
申请人: Apple Inc.
发明人: Erik G. de Jong , Junlin Mu , Sameer Pandya , Patrick J. Crowley , Antonio F. Herrera , James G. Horiuchi , Sherry Tang , Mario Martinis
IPC分类号: H01Q1/27 , H01Q1/24 , H01R12/82 , H01R12/77 , H01M50/284 , H01M10/0525 , H01M10/42 , H01M50/247
摘要: A portable or wearable electronic device can include a device housing defining an internal volume, and an electronic component disposed in the internal volume. The electronic component can be an input component and can have a component housing. The electronic device can also include an antenna feed assembly disposed in the internal volume. The antenna feed assembly can include a conductive grounding component electrically connected to the component housing and the device housing, and an antenna feed component electrically connected to the grounding component and disposed adjacent to the component housing. The conductive grounding component can surround a first major surface and a second major surface of the component housing.
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公开(公告)号:US12003019B2
公开(公告)日:2024-06-04
申请号:US17447555
申请日:2021-09-13
申请人: Apple Inc.
发明人: Erik G. de Jong , Junlin Mu , Sameer Pandya , Patrick J. Crowley , Antonio F. Herrera , James G. Horiuchi , Sherry Tang , Mario Martinis
IPC分类号: H01Q11/02 , H01M10/0525 , H01M10/42 , H01M50/247 , H01M50/284 , H01Q1/24 , H01Q1/27 , H01R12/77 , H01R12/82
CPC分类号: H01Q1/273 , H01M10/0525 , H01M10/425 , H01M50/247 , H01M50/284 , H01Q1/241 , H01R12/77 , H01R12/82 , H01M2220/30
摘要: A portable or wearable electronic device can include a device housing defining an internal volume, and an electronic component disposed in the internal volume. The electronic component can be an input component and can have a component housing. The electronic device can also include an antenna feed assembly disposed in the internal volume. The antenna feed assembly can include a conductive grounding component electrically connected to the component housing and the device housing, and an antenna feed component electrically connected to the grounding component and disposed adjacent to the component housing. The conductive grounding component can surround a first major surface and a second major surface of the component housing.
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