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公开(公告)号：US11134325B2
公开(公告)日：2021-09-28
申请号：US16450808
申请日：2019-06-24
Applicant: Apple Inc.
Inventor： Peter C. Hrudey , Anthony D. Minervini , Joseph R. Maurer
Abstract: A microphone assembly has an interconnect substrate and a microphone transducer coupled with the substrate. A lid overlies the microphone transducer. At least a portion of the lid is spaced from the substrate, defining an acoustic chamber for the microphone transducer. The lid can have a layer of discretized metal or other patterned conductor. The discretized layer of metal or other patterned conductor is configured to inhibit formation of eddy currents, as when exposed to electromagnetic radiation. The lid can be grounded. Microphone modules and electronic devices also are described.
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