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1.发明授权公开(公告)号：US10566687B2
公开(公告)日：2020-02-18
申请号：US15917083
申请日：2018-03-09
Applicant: Apple Inc.
Inventor： Colin M. Ely , Christopher D. Prest , Lucy E. Browning , Stephen B. Lynch , Eric S. Laakmann , Paul L. Nangeroni
Abstract: A housing for an electronic device, including an aluminum layer enclosing a volume that includes a radio-frequency (RF) antenna is provided. The housing includes a window aligned with the RF antenna; the window including a non-conductive material filling a cavity in the aluminum layer; and a thin aluminum oxide layer adjacent to the aluminum layer and to the non-conductive material; wherein the non-conductive material and the thin aluminum oxide layer form an RF-transparent path through the window. A housing for an electronic device including an integrated RF-antenna is also provided. A method of manufacturing a housing for an electronic device as described above is provided.
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2.发明授权Antenna window and antenna pattern for electronic devices and methods of manufacturing the same 有权用于电子设备的天线窗口和天线方向图及其制造方法公开(公告)号：US09209513B2
公开(公告)日：2015-12-08
申请号：US13973939
申请日：2013-08-22
Applicant: Apple Inc.
Inventor： Colin M. Ely , Christopher D. Prest , Lucy E. Browning , Stephen B. Lynch , Eric S. Laakmann , Paul L. Nangeroni
CPC classification number: H01Q1/42 , C23C14/16 , C23C14/5853 , C23C16/06 , C23C28/322 , C23C28/345 , H01Q1/24 , H01Q1/243
Abstract: A housing for an electronic device, including an aluminum layer enclosing a volume that includes a radio-frequency (RF) antenna is provided. The housing includes a window aligned with the RF antenna; the window including a non-conductive material filling a cavity in the aluminum layer; and a thin aluminum oxide layer adjacent to the aluminum layer and to the non-conductive material; wherein the non-conductive material and the thin aluminum oxide layer form an RF-transparent path through the window. A housing for an electronic device including an integrated RF-antenna is also provided. A method of manufacturing a housing for an electronic device as described above is provided.
Abstract translation: 提供了一种用于电子设备的外壳，包括包围有包括射频（RF）天线的音量的铝层）。 壳体包括与RF天线对准的窗口; 所述窗口包括填充所述铝层中的空腔的非导电材料; 以及与铝层和非导电材料相邻的薄的氧化铝层; 其中所述非导电材料和所述薄氧化铝层形成穿过所述窗口的RF透明路径。 还提供了一种用于包括集成RF天线的电子设备的外壳。 提供了如上所述制造用于电子设备的外壳的方法。
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3.发明申请公开(公告)号：US20200153092A1
公开(公告)日：2020-05-14
申请号：US16744710
申请日：2020-01-16
Applicant: Apple Inc.
Inventor： Colin M. Ely , Christopher D. Prest , Lucy E. Browning , Stephen B. Lynch , Eric S. Laakmann , Paul L. Nangeroni
Abstract: A housing for an electronic device, including an aluminum layer enclosing a volume that includes a radio-frequency (RF) antenna is provided. The housing includes a window aligned with the RF antenna; the window including a non-conductive material filling a cavity in the aluminum layer; and a thin aluminum oxide layer adjacent to the aluminum layer and to the non-conductive material; wherein the non-conductive material and the thin aluminum oxide layer form an RF-transparent path through the window. A housing for an electronic device including an integrated RF-antenna is also provided. A method of manufacturing a housing for an electronic device as described above is provided.
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4.发明授权公开(公告)号：US09941581B2
公开(公告)日：2018-04-10
申请号：US14945335
申请日：2015-11-18
Applicant: Apple Inc.
Inventor： Colin M. Ely , Christopher D. Prest , Lucy E. Browning , Stephen B. Lynch , Eric S. Laakmann , Paul L. Nangeroni
CPC classification number: H01Q1/42 , C23C14/16 , C23C14/5853 , C23C16/06 , C23C28/322 , C23C28/345 , H01Q1/24 , H01Q1/243
Abstract: A housing for an electronic device, including an aluminum layer enclosing a volume that includes a radio-frequency (RF) antenna is provided. The housing includes a window aligned with the RF antenna; the window including a non-conductive material filling a cavity in the aluminum layer; and a thin aluminum oxide layer adjacent to the aluminum layer and to the non-conductive material; wherein the non-conductive material and the thin aluminum oxide layer form an RF-transparent path through the window. A housing for an electronic device including an integrated RF-antenna is also provided. A method of manufacturing a housing for an electronic device as described above is provided.
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