公开(公告)号：US11123944B1

公开(公告)日：2021-09-21

申请号：US16214605

申请日：2018-12-10

Applicant: Amazon Technologies, Inc.

Inventor： Brian Hoffman ,  Alexandra Hartford ,  Mohan Mahadevan ,  John Matrecano ,  Timothy Talda

IPC: B65B55/20 ,  B65B33/00 ,  B65B57/10 ,  B31D5/00 ,  B65B5/10 ,  B65D81/113 ,  B65B5/02 ,  B33Y30/00 ,  B33Y10/00 ,  B29C64/393 ,  B33Y50/02 ,  B29C64/209 ,  B29C64/106

Abstract: Dunnage may be applied to surfaces of items by nozzles coupled to one or more robotic arms that may be operated in six degrees of freedom within three-dimensional space. The dunnage is applied in substantially hollow pieces or sections by one or more 3D printing processes, e.g., by deposition. Such pieces or sections may be applied in one or more series or patterns along surfaces of an item prior to enveloping the item in one or more wraps or covers, or depositing the item in one or more containers. Various characteristics of the dunnage, such as materials from which the dunnage is formed, diameters or thicknesses of the dunnage, the series or patterns in which the dunnage is applied to the surface of the item, or any other factors may be selected based on one or more attributes of the items, such as dimensions or shipping and handling instructions.