公开(公告)号：US09674965B1

公开(公告)日：2017-06-06

申请号：US14306030

申请日：2014-06-16

Applicant: Amazon Technologies, Inc.

Inventor： Jeffrey Steven Salinger ,  James Nelson Aldrich ,  Aviv Shoval

IPC: B29C65/14 ,  H05K3/36 ,  H05K1/14 ,  G06F3/041

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103

Abstract: Utilizing a pressure-sensitive adhesive (PSA) for assembling an electronic device can have certain benefits, such as ease of automation and instant handling or short handling time that may save time, effort, and costs during manufacturing. A liquid adhesive, on the other hand, can provide superior bond strength relative to a PSA such that a device manufactured using a liquid adhesive may perform better with respect to structural rigidity, dynamic response, impact resistance, and other reliability testing. An electronic device manufacturer can take advantage of the benefits of each type of adhesive during device assembly by incorporating both a PSA and a liquid adhesive to bond two substrates of the device, such as a cover glass or sheet and a housing structure or frame.