公开(公告)号：US11775119B1

公开(公告)日：2023-10-03

申请号：US17224756

申请日：2021-04-07

Applicant: Amazon Technologies, Inc.

Inventor： Fubin Song ,  Chaoran Yang ,  Shoubao Wang ,  Lixin Wu ,  Cheng Xue

IPC: G06F3/044 ,  H05K1/02 ,  G06F1/18 ,  H05K9/00

CPC classification number: G06F3/044 ,  G06F1/182 ,  H05K1/023 ,  H05K9/0064 ,  G06F2203/04107 ,  H05K9/0071 ,  H05K2201/0707 ,  H05K2201/10151

Abstract: Systems, methods, and computer-readable media are disclosed for capacitive touch sensing using system-in-package components. In one embodiment, a device may include a flexible printed circuit, and a first system-in-package disposed on a first side of the flexible printed circuit. The first system-in-package may include a first molding compound, and a first electromagnetic interference shield disposed around an outer surface of the first molding compound. The device may include a first capacitive touch sensor, and a first stiffener disposed on a second side of the flexible printed circuit, where the first stiffener can be formed of a conductive material, and can be electrically coupled to both the flexible printed circuit and the first capacitive touch sensor. The first capacitive touch sensor may be configured to detect a change in capacitance via a change in electric field at the first electromagnetic interference shield.