公开(公告)号：US11132172B1

公开(公告)日：2021-09-28

申请号：US17038993

申请日：2020-09-30

Applicant: Amazon Technologies, Inc.

Inventor： Apoorv Naik ,  Samer A. Sarhan Hussein ,  Shubhashri Mohanty ,  Michael A Pogue ,  Ali Tootoonchian ,  Nitin Arora ,  Victor Daniel Bazan

IPC: G06F17/00 ,  G06F3/16 ,  G06F16/64 ,  G10H1/36

Abstract: Systems and methods for low latency audio data pipelines are disclosed. For example, a software enabled access point is established for direct wireless communication between a microphone device and an electronic device. Additionally, an audio data processing pipeline that bypasses default data processing of an operating system stack of the electronic device is utilized. The audio data processing pipeline includes minimal audio data processing that writes audio data directly to hardware components for output of corresponding audio.