Electronic device
    2.
    外观设计

    公开(公告)号:USD1009856S1

    公开(公告)日:2024-01-02

    申请号:US29711472

    申请日:2019-10-31

    Abstract: The file of this patent contains at least one drawing executed in color. Copies of this patent with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
    FIG. 1 is a top front perspective view of an electronic device showing our new design in a closed position;
    FIG. 2 is a front elevational view thereof;
    FIG. 3 is a rear elevational view thereof;
    FIG. 4 is a left side elevational view thereof;
    FIG. 5 is a right side elevational view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof; and,
    FIG. 8 is another front perspective view of the electronic device in a partially closed position.
    The broken lines showing portions of the electronic device form no part of the claimed design.

    Electronic device
    3.
    发明授权

    公开(公告)号:US11809227B2

    公开(公告)日:2023-11-07

    申请号:US17468386

    申请日:2021-09-07

    CPC classification number: G06F1/1616

    Abstract: An electronic device is provided. The electronic device includes a function module, a casing, and a cover. The casing includes a space to accommodate the function module. The cover includes a frame and an extending portion. The frame covers the casing. The extending portion extends outward from a sidewall of the frame to protrude from the casing, and the extending portion and the frame are integrally formed.

    Protective case
    5.
    发明授权

    公开(公告)号:US11103039B2

    公开(公告)日:2021-08-31

    申请号:US16821126

    申请日:2020-03-17

    Abstract: A protective case adapted for an electronic device is provided. The protective case includes a plurality of plates, at least one pivot module, an outer covering layer, and an inner covering layer. Each plate includes an inner surface and an outer surface, and at least one recess is defined between the plates. The pivot module is disposed in the recess and is connected to the plates. The outer covering layer is bonded to the outer surface of each plate and covers the recess. The inner covering layer is bonded to the inner surface of each plate and covers the recess. A side edge of the outer surface adjacent to the recess includes a chamfer.

Patent Agency Ranking