公开(公告)号：US20020177875A1

公开(公告)日：2002-11-28

申请号：US10083177

申请日：2002-02-25

Applicant: ASM Assembly Automation Ltd

Inventor： Ching Man Stanley Tsui ,  M. Bilan Curito JR. ,  Lap Kei Eric Chow

IPC: A61B017/28

CPC classification number: A61B17/29 ,  A61B17/0218 ,  A61B18/1445 ,  A61B2017/2929 ,  H01L21/67092 ,  H01L21/67282 ,  H01L21/681 ,  H01L21/78 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means, and without removal therefrom.

Abstract translation: 本发明提供一种用于处理电子元件阵列的方法和装置。 它涉及提供安装装置，以将未卷曲的部件安装到安装装置上，将部件分离成物理分离它们，以及在分离的电子部件安装在安装装置上时进行缺陷测试，并且不从其中移除。