-
公开(公告)号：CN1115169A
公开(公告)日：1996-01-17
申请号：CN95104091.X
申请日：1995-03-17
Applicant: 株式会社日立制作所
IPC: H05K1/00
CPC classification number: H01L23/13 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L2224/04105 , H01L2224/16225 , H01L2224/2402 , H01L2224/24137 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
Abstract: 提供一种通用大型计算机和高速信息处理机用的薄型高密度安装基板。在装载有在LSI内部没有多层布线、仅形成了元件的存储器LSI和逻辑LSI的陶瓷基板上，设置担任两种LSI的信号转送的多层布线，获得了薄型的安装基板。
-
公开(公告)号：CN1045865C
公开(公告)日：1999-10-20
申请号：CN95104091.X
申请日：1995-03-17
Applicant: 株式会社日立制作所
CPC classification number: H01L23/13 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L2224/04105 , H01L2224/16225 , H01L2224/2402 , H01L2224/24137 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
Abstract: 提供一种通用大型计算机和高速信息处理机用的薄型高密度安装基板。在装载有在LSI内部没有多层布线、仅形成了元件的存储器LSI和逻辑LSI的陶瓷基板上，设置担任两种LSI的信号传送的多层布线，获得了薄型的安装基板。
-
公开(公告)号：CN1102017C
公开(公告)日：2003-02-19
申请号：CN97125918.6
申请日：1995-03-17
Applicant: 株式会社日立制作所
IPC: H05K1/18 , H01L23/538 , H01L23/12
CPC classification number: H01L23/13 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L2224/04105 , H01L2224/16225 , H01L2224/2402 , H01L2224/24137 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
Abstract: 提供了一种用于通用的大型计算机和高速信息处理机的薄型高密度安装基板。所述薄型安装基板在安装着仅形成有元件的存储器LSI和逻辑LSI的陶瓷基板上、设有进行两个LSI的信号传送的多层布线层。所述LSI内部没有多层布线层。
-
公开(公告)号：CN1193886A
公开(公告)日：1998-09-23
申请号：CN97125918.6
申请日：1995-03-17
Applicant: 株式会社日立制作所
IPC: H05K1/18 , H01L23/538 , H01L23/12
CPC classification number: H01L23/13 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L2224/04105 , H01L2224/16225 , H01L2224/2402 , H01L2224/24137 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
Abstract: 提供了一种用于通用的大型计算机和高速信息处理机的薄型高密度安装基板。所述薄型安装基板在安装着仅形成有元件的存储器LSI和逻辑LSI的陶瓷基板上、设有进行两个LSI的信号传送的多层布线层。所述LSI内部没有多层布线层。
