- 专利标题: Components feeding apparatus
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申请号: US435164申请日: 1989-11-13
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公开(公告)号: USRE33780E公开(公告)日: 1991-12-31
- 发明人: Masato Itagaki , Katsuaki Kikuchi , Susumu Nakayama , Yoshio Haeda , Takashi Kawakami
- 申请人: Masato Itagaki , Katsuaki Kikuchi , Susumu Nakayama , Yoshio Haeda , Takashi Kawakami
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX60-80101 19850417
- 主分类号: B23P21/00
- IPC分类号: B23P21/00 ; B23P19/00 ; B23Q7/14 ; B65G25/04 ; B65G35/00 ; B65G43/08 ; B65G54/02 ; H05K3/02 ; H05K3/30 ; H05K13/02 ; H05K13/04
摘要:
In an electronic component mounting apparatus comprises a component feeding section including a feeding table unit loaded with several types of electronic components which feeding table unit is adapted to laterally reciprocate on a base, and stopping at a predetermined position thereby to feed the components continuously to a transfer mechanism, the transfer mechanism for absorbing the electronic components and mounting them on a board on an X-Y table on the other side, the X-Y table fixing and stopping the board to a predetermined position, and a board transport section for transporting the board onto the X-Y table for delivering the board having the electronic components mounted thereon, a component feeding apparatus wherein the component feeding table unit of the component feeding section is divided into a plurality of feeding tables each adapted to be moved individually on a straight line by a drive mechanism, the apparatus further comprising means for moving the table to a predetermined position in opposed relationship with the transfer mechanism in response to a command from the control unit.
公开/授权文献
- US5560777A Apparatus for making a semiconductor 公开/授权日:1996-10-01
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