Three dimensional faceted identification chip

Design

USD911331S1 Three dimensional faceted identification chip 有权

Patent Title: Three dimensional faceted identification chip
Application No.: US29684253

Application Date: 2019-03-19
Publication No.: USD911331S1

Publication Date: 2021-02-23
Designer: Hyeob Kim , Thomas Eugene Pangburn , Scott Richard Castle , Robert Henry Muyskens , Brant Dennis Nystrom , Samuel Leo Rhodus
Applicant: Lexmark International, Inc.
Applicant Address: US KY Lexington
Assignee: Lexmark International, Inc.
Current Assignee: Lexmark International, Inc.
Current Assignee Address: US KY Lexington
LOC classification number: 1402

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