Invention Grant
- Patent Title: Bonding structure and method
-
Application No.: US15663802Application Date: 2017-07-30
-
Publication No.: US09997485B2Publication Date: 2018-06-12
- Inventor: Shutesh Krishnan , Yun Sung Won
- Applicant: Semiconductor Components Industries, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Rennie William Dover
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495
Abstract:
A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a substrate and a workpiece is placed on the nanoparticle preform.
Public/Granted literature
- US20170352635A1 BONDING STRUCTURE AND METHOD Public/Granted day:2017-12-07
Information query
IPC分类:
