A pair of solder bonding portions to be solder-bonded onto the printed wiring board and a contact portion to contact the different conductive member or the like are coupled by a pair of flat spring portions. The respective flat spring portions protrude from side surfaces of mutually opposed corners of the contact portion. Sections following protruded sections of the respective flat spring portions are bent so as to wind in the same direction around a pillar-shaped space obtained by projecting the contact portion downward, and the flat spring portions reach the corresponding solder bonding portions. When the contact portion is pressed by the conductive member, the contact portion and the solder bonding portions remain parallel to each other, whereby the contact member can be successfully flattened toward the printed wiring board. At this point, outward deformation of the flat spring portions is inhibited.