- 专利标题： Packages with stacked dies and methods of forming the same
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申请号： US15147574申请日： 2016-05-05
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公开(公告)号： US09984999B2公开(公告)日： 2018-05-29
- 发明人: Chien-Hsun Lee , Dean Wang , Mirng-Ji Lii , Chen-Hua Yu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L25/065 ; H01L21/56 ; H01L23/00 ; H01L23/367 ; H01L23/373 ; H01L23/498 ; H01L21/78 ; H01L25/18 ; H01L25/00 ; H01L23/31
摘要：
A method includes bonding a first plurality of device dies onto a wafer, wherein the wafer includes a second plurality of device dies, with each of the first plurality of device dies bonded to one of the second plurality of device dies. The wafer is then sawed to form a die stack, wherein the die stack includes a first device die from the first plurality of device dies and a second device die from the second plurality of device dies. The method further includes bonding the die stack over a package substrate.
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