An electronic device having an enclosure with a sealing element to prevent ingress of contaminants at an interface between sealing element and a material is disclosed. The material may include an injection molded material that forms at least part of a radio frequency transparent window. The enclosure may include a first channel that receives the material. A second channel may open to the first channel and receive the sealing element. The sealing element may initially extend at least partially into the first channel. However, the material may provide compression forces to the sealing element to compress the sealing element out of the first channel, or at least compress the sealing element further into the second channel. The sealing element may provide a counterforce against the material to increase or enhance a seal against ingress attempting to pass through the enclosure at the interface between sealing element and the material.