- 专利标题: Midplane interconnect system with conductor twist mitigation
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申请号: US15583159申请日: 2017-05-01
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公开(公告)号: US09954295B2公开(公告)日: 2018-04-24
- 发明人: Wayne Genetti , Vladimir Tamarkin
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwegman Lundberg & Woessner, P.A.
- 主分类号: G02B6/28
- IPC分类号: G02B6/28 ; H01R12/71 ; G02B6/44 ; G06F1/18 ; G06F13/40
摘要:
A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.
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