- 专利标题： Wafer level contact pad solder bumping for surface mount devices with non-planar recessed contacting surfaces
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申请号： US14152829申请日： 2014-01-10
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公开(公告)号： US09954144B2公开(公告)日： 2018-04-24
- 发明人: Chandan Bhat , Theodore Lowes
- 申请人： Cree, Inc.
- 申请人地址： US NC Durham
- 专利权人： CREE, INC.
- 当前专利权人： CREE, INC.
- 当前专利权人地址： US NC Durham
- 代理机构： Koppel, Patrick, Heybl & Philpott
- 主分类号： H01L33/46
- IPC分类号： H01L33/46 ; H01L33/48 ; H01L33/62
摘要：
This disclosure related to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads with protruding contact bumps. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at least a contact pad, such that the contact pad is recessed in relation to a surface of the device. Contact bumps are formed in contact with the contact pads, such that the contact bumps protrude beyond the surface and may contact a surface of a submount that the device is meant to be mounted to. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.
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