An electronic component device includes a first electronic component, a second electronic component disposed on and connected to the first electronic component, a first underfill resin filled between the first electronic component and the second electronic component, the first underfill resin having a base part arranged around the second electronic component and a convex portion formed on an upper surface of the base part, a third electronic component disposed on and connected to the second electronic component with being in contact with the convex portion of the base part at a peripheral edge portion thereof, and a second underfill resin filled between the second electronic component and the third electronic component.