- 专利标题： Packaging for high speed chip to chip communication
-
申请号： US15453334申请日： 2017-03-08
-
公开(公告)号： US09953935B2公开(公告)日： 2018-04-24
- 发明人: Shidong Li
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： Cantor Colburn LLP
- 代理商 Jennifer Anda
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/00 ; H01L23/367 ; H01L23/498 ; H01L21/48
摘要：
Disclosed are chip packaging structures for high speed chip to chip and chip to carrier communications and methods of making such structures. The chip packaging structures do not require an interposer containing through silicon vias and/or provide structures having reduced warping.
公开/授权文献
- US20170179047A1 PACKAGING FOR HIGH SPEED CHIP TO CHIP COMMUNICATION 公开/授权日：2017-06-22
信息查询
IPC分类:
