- 专利标题: Semiconductor device and semiconductor package
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申请号: US15090212申请日: 2016-04-04
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公开(公告)号: US09953921B2公开(公告)日: 2018-04-24
- 发明人: Hyun-Bae Lee
- 申请人: SK hynix Inc.
- 申请人地址: KR Gyeonggi-do
- 专利权人: SK Hynix Inc.
- 当前专利权人: SK Hynix Inc.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: IP & T Group LLP
- 优先权: KR10-2015-0159707 20151113
- 主分类号: H03K3/00
- IPC分类号: H03K3/00 ; H01L23/528 ; H01L23/522 ; H01L25/065
摘要:
A semiconductor device may include a first metal line; a second metal line; a first insulating layer formed between the first metal line and the second metal line; a first driving unit coupled to the first metal line, the first driving unit being suitable for driving the first metal line in response to first data; and a second driving unit coupled to the second metal line, the second driving unit being suitable for driving the second metal line in response to second data obtained by inverting and delaying the first data.
公开/授权文献
- US20170141025A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE 公开/授权日:2017-05-18
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