According to various aspects, exemplary embodiments are disclosed of board level shields that include film and/or foil (e.g., electrically-conductive plastic film, metallized or metal plated film, metal foil, reinforced foil, poly-foil, etc.) covers or lids. Also disclosed are exemplary embodiments of methods relating to making EMI shielding apparatus or assemblies. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.