A splice device for electromagnetically sealing a junction or bond between a plurality of cables is provided. A first and second cable each has a conductive core wire, an inner insulation, a braided sleeve, and an insulating cover. The junction or bond fixes and electrically connects the core wire of the second cable to the core wire of the first cable. A plurality of ferrules overlays the braided sleeve and the insulating cover of the first cable and the braided sleeve and the insulating cover of the second cable. A plurality of ring collars overlays the plurality of ferrules and is fixed to the plurality of ferrules. A splice cover or shield overlays the first cable, second cable, plurality of ferrules, and plurality of ring collars and electromagnetically seals the junction/bond between the core wires of the first cable and the second cable.