Invention Grant
- Patent Title: Audio jack connector having compressive contacts
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Application No.: US15173942Application Date: 2016-06-06
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Publication No.: US09923291B2Publication Date: 2018-03-20
- Inventor: Hendrikus P. G. Van der Steen
- Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Applicant Address: KY Grand Cayman
- Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee Address: KY Grand Cayman
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: CN201510301685 20150605
- Main IPC: H01R24/58
- IPC: H01R24/58 ; H01R12/72 ; H01R12/70 ; H01R13/50 ; H01R24/60 ; H01R12/58 ; H01R13/24 ; H01R107/00
Abstract:
An audio jack connector, assembled to a printed circuit board having a number of conductive pads, includes an insulative housing having a number of receiving grooves and a number of terminals received in the receiving grooves. Each audio terminal includes an elastic portion having a number of compressive contacts laterally. The elastic portion is pressed laterally by the printed circuit board so that the compressive contacts are contacted with the conductive pads.
Public/Granted literature
- US20160359250A1 AUDIO JACK CONNECTOR HAVING COMPRESSIVE CONTACTS Public/Granted day:2016-12-08
Information query
