- 专利标题: Bonding method with curing by reflected actinic rays
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申请号: US15317056申请日: 2014-07-25
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公开(公告)号: US09918683B2公开(公告)日: 2018-03-20
- 发明人: Anton Petrus Maria Van Arendonk
- 申请人: TELEDYNE DALSA, INC.
- 申请人地址: CA
- 专利权人: TELEDYNE DALSA, INC.
- 当前专利权人: TELEDYNE DALSA, INC.
- 当前专利权人地址: CA
- 代理机构: McGuireWoods LLP
- 国际申请: PCT/CA2014/000585 WO 20140725
- 国际公布: WO2016/011523 WO 20160128
- 主分类号: G01T1/24
- IPC分类号: G01T1/24 ; A61B6/00 ; G01T7/00 ; F16B11/00 ; H01L27/146 ; H01L31/08
摘要:
A method of making a device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, involves bringing the component and supporting frame together with a layer of adhesive applied between them. The part of the adhesive layer in the shadow of the opaque portions is cured by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions.
公开/授权文献
- US20170119326A1 BONDING METHOD WITH CURING BY REFLECTED ACTINIC RAYS 公开/授权日:2017-05-04
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