- 专利标题: Methods and systems for solid state heat transfer
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申请号: US14535770申请日: 2014-11-07
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公开(公告)号: US09885502B2公开(公告)日: 2018-02-06
- 发明人: Sidney W. K. Yuan , Tung T. Lam
- 申请人: The Aerospace Corporation
- 申请人地址: US CA El Segundo
- 专利权人: The Aerospace Corporation
- 当前专利权人: The Aerospace Corporation
- 当前专利权人地址: US CA El Segundo
- 代理机构: K&L Gates LLP
- 主分类号: F25B21/02
- IPC分类号: F25B21/02 ; F25B21/04 ; F25B40/00 ; H01L35/32 ; F28F13/00
摘要:
Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.
公开/授权文献
- US20160169564A1 METHODS AND SYSTEMS FOR SOLID STATE HEAT TRANSFER 公开/授权日:2016-06-16
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