- 专利标题: Light emitting device package having LED disposed in lead frame cavities
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申请号: US14155519申请日: 2014-01-15
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公开(公告)号: US09882104B2公开(公告)日: 2018-01-30
- 发明人: Buem Yeon Lee
- 申请人: LG INNOTEK CO., LTD.
- 申请人地址: KR Seoul
- 专利权人: LG INNOTEK CO., LTD
- 当前专利权人: LG INNOTEK CO., LTD
- 当前专利权人地址: KR Seoul
- 代理机构: KED & Associates, LLP
- 优先权: KR10-2011-0076250 20110729
- 主分类号: H01L33/62
- IPC分类号: H01L33/62 ; H01L25/04 ; H01L25/075 ; H01L33/48 ; H01L25/16 ; H01L33/40 ; H01L33/60 ; H01L33/64 ; F21V29/15 ; F21Y105/10 ; F21K9/23 ; F21Y115/10
摘要:
Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a first cavity in a first region of the body; a second cavity in a second region of the body; first and second lead frames spaced apart from each other in the first cavity; a third lead frame spaced apart from the second lead frame in the second cavity; a first light emitting device on the first and second lead frames in the first cavity; a second light emitting device on the second and third lead frames in the second cavity; and a molding member in the first and second cavities.
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