Invention Grant
- Patent Title: Synchronous data-link throughput enhancement technique based on data signal duty-cycle and phase modulation/demodulation
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Application No.: US13887846Application Date: 2013-05-06
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Publication No.: US09875209B2Publication Date: 2018-01-23
- Inventor: Lalan J. Mishra , Dexter T. Chun , Animesh Datta
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated-Toler
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G11C7/22 ; G11C7/10 ; G06F13/16 ; H04L7/00 ; H04L25/49
Abstract:
A synchronous data-link throughput enhancement technique based on data signal duty-cycle and phase modulation demodulation is disclosed. A method includes receiving multiple bits to be transmitted, encoding the multiple bits to generate a multi-bit signal that represents the multiple bits, and transmitting, via a synchronous interface, the multi-bit signal during a time period that corresponds to one-half of a cycle of a synchronization signal.
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