Some example forms relate a method of fabricating an electronic package. The method includes attaching a source wafer that includes micro devices to a target wafer. The method further includes removing a portion of the source wafer from the target wafer to form an electronic package. The micro devices remain on the target wafer when the source wafer is removed from target wafer. The method may further include performing post processing on the electronic package that is formed after the source wafer is removed from the target wafer. In some forms of the method, some of the micro devices remain on the source wafer when the source wafer is removed from target wafer.