- 专利标题: Resistive film with ductile particles
-
申请号: US15500907申请日: 2014-07-31
-
公开(公告)号: US09846381B2公开(公告)日: 2017-12-19
- 发明人: Thomas Anthony , Seongsik Chang
- 申请人: Hewlett-Packard Development Company, L.P.
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 代理商 Michael A. Dryja
- 国际申请: PCT/US2014/049144 WO 20140731
- 国际公布: WO2016/018366 WO 20160204
- 主分类号: G03G15/02
- IPC分类号: G03G15/02 ; C23C16/44
摘要:
A resistive film is applied to a conductive substrate. Ductile particles are disposed substantially uniformly throughout the resistive film. Brittleness of the resistive film is thereby reduced.
公开/授权文献
- US20170235246A1 RESISTIVE FILM WITH DUCTILE PARTICLES 公开/授权日:2017-08-17
信息查询