- 专利标题: Plasma processing apparatus
-
申请号: US14526900申请日: 2014-10-29
-
公开(公告)号: US09831064B2公开(公告)日: 2017-11-28
- 发明人: Hiroo Konno , Takashi Shimomoto
- 申请人: Tokyo Electron Limited , Daihen Corporation
- 申请人地址: JP Tokyo JP Osaka-shi, Osaka
- 专利权人: TOKYO ELECTRON LIMITED,DAIHEN CORPORATION
- 当前专利权人: TOKYO ELECTRON LIMITED,DAIHEN CORPORATION
- 当前专利权人地址: JP Tokyo JP Osaka-shi, Osaka
- 代理机构: Pearne & Gordon LLP
- 优先权: JP2013-229382 20131105
- 主分类号: H01J37/32
- IPC分类号: H01J37/32
摘要:
A plasma processing apparatus can control a ratio between an input power during a pulse-on period and an input power during a pulse-off period by a matching operation of a matching device provided on a high frequency transmission line for supplying the high frequency power as a continuous wave without a power modulation. An impedance sensor 96A provided in a matching device of a plasma generation system includes a RF voltage detector 100; a voltage-detection-signal generating circuit 102; an arithmetic-average-value calculating circuit 104; a weighted-average-value calculating circuit 106; and a moving-average-value calculating unit 108 of a voltage sensor system, and also includes a RF electric current detector 110; an electric current-detection-signal generating circuit 112; an arithmetic-average-value calculating circuit 114; a weighted-average-value calculating circuit 116; a moving-average-value calculating unit 118; and an impedance calculating circuit 120 of an electric current sensor system.
公开/授权文献
- US20150122420A1 PLASMA PROCESSING APPARATUS 公开/授权日:2015-05-07
信息查询