- 专利标题： Semiconductor module and method of manufacturing semiconductor module
-
申请号： US15177658申请日： 2016-06-09
-
公开(公告)号： US09818687B2公开(公告)日： 2017-11-14
- 发明人: Naoyuki Kanai
- 申请人： Fuji Electric Co., Ltd.
- 申请人地址： JP Kanagawa
- 专利权人： FUJI ELECTRIC CO., LTD.
- 当前专利权人： FUJI ELECTRIC CO., LTD.
- 当前专利权人地址： JP Kanagawa
- 代理机构： Chen Yoshimura LLP
- 优先权： JP2015-146103 20150723
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/31 ; H01L21/56 ; H01L21/48 ; H01L23/24 ; H01L23/60 ; H01L23/373 ; H01L23/00 ; H01L25/07 ; H01L23/14
摘要：
A semiconductor module includes an insulated circuit board that includes an insulating substrate, a first conductive plate arranged on a first principal surface of the insulating substrate and within the outer edges of the insulating substrate, and a second conductive plate arranged within the outer edges of the insulating substrate on a second principal surface of the insulating substrate that faces the first principal surface. Furthermore, boundary edges between the first principal surface of the insulating substrate and the side faces of the first conductive plate are covered by an ion gel that contains an ionic liquid.
公开/授权文献
信息查询
IPC分类:
