- 专利标题: Fingerprint identification module
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申请号: US15151471申请日: 2016-05-10
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公开(公告)号: US09818017B2公开(公告)日: 2017-11-14
- 发明人: Jen-Chieh Wu
- 申请人: Gingy Technology Inc.
- 申请人地址: TW Hsinchu
- 专利权人: Gingy Technology Inc.
- 当前专利权人: Gingy Technology Inc.
- 当前专利权人地址: TW Hsinchu
- 代理机构: JCIPRNET
- 优先权: TW104140901A 20151207
- 主分类号: G06K9/00
- IPC分类号: G06K9/00
摘要:
A fingerprint identification module includes a cover plate, a fingerprint identification sensor, at least one light source, and a plurality of fibers. The cover plate has an inner surface and an outer surface opposite to the inner surface. The fingerprint identification sensor and the at least one light source are located under the inner surface, and the at least one light source is located adjacent to the fingerprint identification sensor. The fibers are arranged in an array and are located between the cover plate and the fingerprint identification sensor, wherein each of the fibers has a light incident surface. The light incident surface faces the inner surface and is inclined relative to the inner surface.
公开/授权文献
- US20170011248A1 FINGERPRINT IDENTIFICATION MODULE 公开/授权日:2017-01-12
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