- 专利标题: Molding sand for three dimensional laminate molding
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申请号: US14343893申请日: 2012-09-10
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公开(公告)号: US09796015B2公开(公告)日: 2017-10-24
- 发明人: Yoya Fukuda , Kenichi Hayashi , Takashi Komai , Yusuke Urushibata , Yusuke Tomita
- 申请人: Yoya Fukuda , Kenichi Hayashi , Takashi Komai , Yusuke Urushibata , Yusuke Tomita
- 申请人地址: JP Shizuoka
- 专利权人: Kimura Chuzosho Co., Ltd.
- 当前专利权人: Kimura Chuzosho Co., Ltd.
- 当前专利权人地址: JP Shizuoka
- 代理机构: Osha Liang LLP
- 优先权: JP2012-113632 20120517
- 国际申请: PCT/JP2012/073760 WO 20120910
- 国际公布: WO2013/171921 WO 20131121
- 主分类号: B28B7/36
- IPC分类号: B28B7/36 ; C04B35/66 ; B22C1/10 ; B22C9/02 ; B33Y70/00 ; B22C1/02 ; B22C1/22
摘要:
According to the invention, by setting the linear thermal expansion amount when a mold made of a molding sand is heated from a room temperature to 1000° C. to be not more than 0.9%, and the ratio (D/d) between the diameter of a slump (D) and the diameter of a slump cone (d) in a slump test of the molding sand having a hardening agent kneaded to be not less than 1.65, a molding sand preferable for use in a mold produced using the self-hardening type of three dimensional laminate molding sand mold, having low thermal expansibility preventing occurrence of a veining defect, and capable of forming a large and complicated shape can be obtained.
公开/授权文献
- US20140224152A1 MOLDING SAND FOR THREE DIMENSIONAL LAMINATE MOLDING 公开/授权日:2014-08-14
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