Invention Grant
- Patent Title: Apparatus and method for removing particles present on a wafer using photoelectrons and an electric field
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Application No.: US14927292Application Date: 2015-10-29
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Publication No.: US09796001B2Publication Date: 2017-10-24
- Inventor: Jae Hee Sim , Si Hyun Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon
- Assignee: SK HYNIX INC.
- Current Assignee: SK HYNIX INC.
- Current Assignee Address: KR Icheon
- Priority: KR10-2015-0067525 20150514
- Main IPC: B08B6/00
- IPC: B08B6/00 ; H01L21/02 ; H01L21/67
Abstract:
A wafer processing apparatus includes a particle charger for charging particles adsorbed onto a wafer with photoelectrons emitted from an emitter metal layer and a particle remover for applying an electric field to the wafer, which removes the charged particles from the wafer.
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