- 专利标题： Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same
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申请号： US14851652申请日： 2015-09-11
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公开(公告)号： US09786575B2公开(公告)日： 2017-10-10
- 发明人: Dirk Robert Walter Leipold , Julio C. Costa , Baker Scott
- 申请人： RF Micro Devices, Inc.
- 申请人地址： US NC Greensboro
- 专利权人： Qorvo US, Inc.
- 当前专利权人： Qorvo US, Inc.
- 当前专利权人地址： US NC Greensboro
- 代理机构： Withrow & Terranova, P.L.L.C.
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/02 ; H01L21/3105 ; H01L21/311 ; H01L21/56 ; H01L21/683 ; H01L21/762 ; H01L23/29 ; H01L23/367 ; H01L23/373
摘要：
A printed circuit module and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer. A polymer layer is disposed over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 103 Ohm-cm.
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