Invention Grant
- Patent Title: Tire mounting apparatus
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Application No.: US14295254Application Date: 2014-06-03
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Publication No.: US09757828B2Publication Date: 2017-09-12
- Inventor: Saeko Komatsu , Yoshito Otake
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2008-019126 20080130; JP2008-019131 20080130; JP2008-022395 20080201; JP2008-174717 20080703; JP2008-174722 20080703; JP2008-174726 20080703
- Main IPC: B23P19/00
- IPC: B23P19/00 ; B23P19/04 ; B23P19/06 ; B25J15/10 ; B62D65/12 ; B23P21/00 ; B62D65/02

Abstract:
A tire mounting apparatus is constructed from a first working mechanism and a second working mechanism that are separate from each other. The first working mechanism is provided with a tire holding device for holding a tire and with a temporary tightening device for temporarily tightening nuts onto hub bolts to which the tire is mounted. The second working mechanism is provided with a final tightening device means for finally tightening the temporarily tightened nuts. The final tightening device includes two nut runners and an interval adjuster for adjusting an interval between the two nut runners.
Public/Granted literature
- US20140331487A1 TIRE MOUNTING APPARATUS Public/Granted day:2014-11-13
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