Invention Grant
- Patent Title: Wireless power transfer through conductive materials
-
Application No.: US14370794Application Date: 2013-01-07
-
Publication No.: US09743565B2Publication Date: 2017-08-22
- Inventor: Joseph C. Van Den Brink , Hai D. Nguyen , Benjamin C. Moes , Neil W. Kuyvenhoven
- Applicant: Access Business Group International LLC
- Applicant Address: US MI Ada
- Assignee: Access Business Group International LLC
- Current Assignee: Access Business Group International LLC
- Current Assignee Address: US MI Ada
- Agency: Warner Norcross and Judd LLP
- International Application: PCT/US2013/020493 WO 20130107
- International Announcement: WO2013/103948 WO 20130711
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H02J5/00 ; H02J7/02 ; H01F38/14 ; H05B37/02 ; H02J7/00

Abstract:
An electrical component with conductive material(s) that is suitable for use within the electromagnetic field path of a wireless power transfer system. The electronic component includes conductive materials that are sufficiently thin to absorb no more than an acceptable amount of the electromagnetic field, yet thick enough to remain sufficiently conductive to perform the desired electrical function. In embodiments in which the wireless power supply delivers up to 20 watts of power, the conductive materials are not substantially thicker than about 1/10 the skin depth of the material at the anticipated wireless power frequency. The electrical component may be disposed at any location between the wireless power supply transmitter and the remote device receiver. The present invention permits the use of a wide rang of electrical components in the field path, such as a display, a sensor or a component capable of selectively operating as both.
Public/Granted literature
- US20150048752A1 WIRELESS POWER TRANSFER THROUGH CONDUCTIVE MATERIALS Public/Granted day:2015-02-19
Information query