Invention Grant
- Patent Title: Concentric bump design for the alignment in die stacking
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Application No.: US15255963Application Date: 2016-09-02
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Publication No.: US09721916B2Publication Date: 2017-08-01
- Inventor: Jung Wei Cheng , Tsung-Ding Wang , Chien-Hsun Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/544 ; H01L21/78 ; H01L25/065 ; H01L25/00
Abstract:
An integrated circuit structure includes an alignment bump and an active electrical connector. The alignment bump includes a first non-solder metallic bump. The first non-solder metallic bump forms a ring encircling an opening therein. The active electrical connector includes a second non-solder metallic bump. A surface of the first non-solder metallic bump and a surface of the second non-solder metallic bump are substantially coplanar with each other.
Public/Granted literature
- US20160372436A1 Concentric Bump Design for the Alignment in Die Stacking Public/Granted day:2016-12-22
Information query
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