- 专利标题: Magnetic tunnel junctions and methods of forming magnetic tunnel junctions
-
申请号: US14989556申请日: 2016-01-06
-
公开(公告)号: US09691817B2公开(公告)日: 2017-06-27
- 发明人: Gurtej S. Sandhu
- 申请人: Micron Technology, Inc.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Wells St. John, P.S.
- 主分类号: H01L27/22
- IPC分类号: H01L27/22 ; H01L43/12 ; H01L43/02 ; H01L29/82 ; H01L43/08
摘要:
A method of forming a line of magnetic tunnel junctions includes forming magnetic recording material over a substrate, non-magnetic material over the recording material, and magnetic reference material over the non-magnetic material. The substrate has alternating outer regions of reactant source material and insulator material along at least one cross-section. The reference material is patterned into a longitudinally elongated line passing over the alternating outer regions. The recording material is subjected to a set of temperature and pressure conditions to react with the reactant of the reactant source material to form regions of the dielectric material which longitudinally alternate with the recording material along the line and to form magnetic tunnel junctions along the line which individually comprise the recording material, the non-magnetic material, and the reference material that are longitudinally between the dielectric material regions. Other methods, and lines of magnetic tunnel junctions independent of method, are disclosed.
公开/授权文献
信息查询
IPC分类: