- 专利标题： Thin plastic leadless package with exposed metal die paddle
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申请号： US14922899申请日： 2015-10-26
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公开(公告)号： US09691688B2公开(公告)日： 2017-06-27
- 发明人: Mow Lum Yee , Kam Chuan Lau , Kok Siang Goh , Shang Yan Choong , Voon Joon Liew , Chee Sang Yip
- 申请人： Carsem (M) Sdn. Bhd.
- 申请人地址： MY Ipoh, Perak
- 专利权人： CARSEM (M) SDN. BHD.
- 当前专利权人： CARSEM (M) SDN. BHD.
- 当前专利权人地址： MY Ipoh, Perak
- 代理机构： Kilpatrick Townsend & Stockton LLP
- 优先权： MY20071214 20070725
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L23/31 ; H01L23/00 ; H01L21/60
摘要：
A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps. The electronic package includes a leadframe having a plurality of leads, wherein each of the leads has a lead tip, an opening formed within the leadframe, a die paddle that is disposed within the opening and is isolated from each of the lead tips, a tape that is adhered to a back side of the leadframe, leads, and die paddle, and a die, wherein the die is attached to the die paddle and is connected by wires to a bump disposed on each of the lead tips.
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