An imaging system includes plural modular imaging detectors and a readout electronics unit. Each modular imaging detector includes pixels configured to collect imaging data, a substrate on which the pixels are disposed, and a mechanical interconnection feature. The mechanical interconnection feature is configured to cooperate with a corresponding mechanical interconnection feature of at least one other of the modular imaging detectors to directly join the modular imaging detector to the at least one other of the modular imaging detectors. The readout electronics unit is configured to be operably coupled to the modular imaging detectors and to receive signals corresponding to the imaging data from the modular imaging detectors.