Invention Grant
- Patent Title: Necked interconnect fuse structure for integrated circuits
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Application No.: US15124867Application Date: 2014-05-08
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Publication No.: US09679845B2Publication Date: 2017-06-13
- Inventor: Zhanping Chen , Andrew W. Yeoh , Seongtae Jeong , Uddalak Bhattacharya , Charles H. Wallace
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal, LLP
- International Application: PCT/US2014/037266 WO 20140508
- International Announcement: WO2015/171147 WO 20151112
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L23/528 ; H01L21/768

Abstract:
Interconnect fuse structures including a fuse with a necked line segment, as well as methods of fabricating such structures. A current driven by an applied fuse programming voltage may open necked fuse segments to affect operation of an IC. In embodiments, the fuse structure includes a pair of neighboring interconnect lines equidistant from a center interconnect line. In further embodiments, the center interconnect line, and at least one of the neighboring interconnect lines, include line segments of lateral widths that differ by a same, and complementary amount. In further embodiments, the center interconnect line is interconnected at opposite ends of a necked line segment. In further embodiments, the necked line segment is fabricated with pitch-reducing spacer-based patterning process.
Public/Granted literature
- US20170018499A1 NECKED INTERCONNECT FUSE STRUCTURE FOR INTEGRATED CIRCUITS Public/Granted day:2017-01-19
Information query
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