Invention Grant
- Patent Title: Plug-in mechanism, subrack including plug-in mechanism, and finished board
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Application No.: US14577724Application Date: 2014-12-19
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Publication No.: US09674978B2Publication Date: 2017-06-06
- Inventor: Dingqiang Wu , Dongli Wang , Yao Li
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN201210253445 20120720
- Main IPC: H05K7/14
- IPC: H05K7/14 ; G06F1/18

Abstract:
Embodiments of the present invention disclose a plug-in mechanism, a subrack including the plug-in mechanism, and a finished board, and relate to a power mechanism, so as to implement fast and reliable plug-in and plug-out by using a lever assistance effect, and a gearing effect of a parallelogram mechanism. The plug-in mechanism provided by an embodiment of the present invention is configured to be disposed between a sub-carrier frame and a parent carrier frame to implement plug-in and plug-out of the sub-carrier frame in the parent carrier frame, and the plug-in mechanism includes a driving part and a gearing part.
Public/Granted literature
- US20150103492A1 PLUG-IN MECHANISM, SUBRACK INCLUDING PLUG-IN MECHANISM, AND FINISHED BOARD Public/Granted day:2015-04-16
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